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GLOBALFOUNDRIES Expands Cleanroom
Release time:
2013-10-26
GLOBALFOUNDRIES, the semiconductor foundry spun off successfully from AMD, held a press conference in Taipei to announce plans to expand cleanrooms at its 300mm fabs in Dresden, Germany, and in New York State, USA, in order to increase production capacity and meet both short-term and long-term customer demands.
GLOBALFOUNDRIES, the semiconductor foundry that successfully spun off from AMD, held a press conference in Taipei to announce plans to expand cleanrooms at its 300mm fabs in Dresden, Germany, and in New York State, USA, in order to increase production capacity and meet both short-term and long-term customer demands. Following its separation from AMD in 2009 and the subsequent merger with Chartered Semiconductor after Abu Dhabi's investment firm ATC acquired Singapore's Chartered Semiconductor, GLOBALFOUNDRIES has now become the world’s largest semiconductor foundry. It currently operates two 300mm fabs—in Dresden, Germany, and Fab7 in Singapore—as well as four 200mm fabs in Singapore. Additionally, a new 300mm fab in New York State, USA, is under construction. The company serves over 150 customers, including many of the world’s leading chip design firms.
According to the company’s plans, a new factory building will be constructed next to Module 1 (formerly AMD Fab36) and Module 2 (formerly AMD Fab38) at the Fab1 wafer fab located in Dresden, Germany. Upon completion, this new facility will increase Fab1’s cleanroom area by 110,000 square feet, boosting its production capacity from 50,000 300mm wafers per month to 80,000 wafers per month. The project is expected to be completed in 2011, at which point Fab1 will become the largest wafer fab in all of Europe—its footprint will be equivalent to the size of eight football fields. Initially, the fab will employ 45nm/40nm process technology, with the capability to evolve to 28nm in the future.
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